System-level design across sensing, control and measurement, built around the actual application.
Starting from sensor selection and analog front end, the instrument is designed around measurement range, accuracy, repeatability, response time and environmental conditions. Covers signal conditioning, ADC sampling, filtering, calibration, display and communication interfaces.
For thermal image capture, temperature distribution analysis and hotspot detection: module selection, interface integration, image display, area temperature measurement, threshold alarms and data recording.
MCU and ARM hardware and firmware developed together around power, real-time behaviour and interface requirements. Includes drivers, state machines, control logic, fault handling and upgrade mechanisms.
Stable acquisition from sensors, instruments or multiple devices into a host application, covering communication, timestamping, buffering, display and export. Interfaces include UART, RS485/Modbus, USB and Ethernet.